Advantech PCI-1241 Spezifikationen PDF herunterladen (Seite 20)

Solder Placement System for BGA/CSP Chipsets

Semiconductor Production

Taiwan

Introduction

Project Requirements

In a traditional PLC-based system, programming

sophistication and poor data acquisition have limited

efficiency and quality control. Especially for soldering

BGA or CSP chipsets, the solder placement system

requires high quality control and low tolerance for

errors. The newly introduced PC-based solution

has flexible control and real-time monitoring,

and also allows a fully automated operation. In

order to achieve such performance, the following

components are required:

•

A PC-based industrial computer for central

processing with high-speed performance

•

Highly precise soldering process for small

components

The soldering process is a critical stage in the circuit assembly process, as any faults can cause

severe damage to the device. Furthermore, technology improvements and higher consumer

demand for electronic products have forced circuits to evolve smaller and smaller. At the same

time, the need for mass production is inevitable; therefore, having a fast and highly precise

soldering machine is extremely important. With a PC-based solution, both the demand for mass

production and need to keep pace with technology trends can be met.

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Advantech PCI-1241 Spezifikationen Seite 20